Wearout reliability studies of bonding wires used in nano electronic device packing /
The objective of this project is to evaluate the wearout reliability, apparent activation energy and Intermetallic compound (IMC) thickness growth of Au, Pd-coated Cu wire and Pd-doped Cu wire used in semiconductor packaging. Methodology of this work include investigation on the effects of bonding w...
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| Format: | Thesis Book |
| Language: | English |
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Perlis, Malaysia
Institute of Nano Electronic Engineering, Universiti Malaysia Perlis
2014
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