APA(7版)引用形式

Mohd Izrul Izwan Ramli. (2016). The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement. School of Materials Engineering.

Chicagoスタイル(17版)引用形式

Mohd Izrul Izwan Ramli. The Development of Sn-Cu-Ni Lead Free Composite Solder Influence by Non-metallic Reinforcement. Perlis, Malaysia: School of Materials Engineering, 2016.

MLA(8版)引用形式

Mohd Izrul Izwan Ramli. The Development of Sn-Cu-Ni Lead Free Composite Solder Influence by Non-metallic Reinforcement. School of Materials Engineering, 2016.

警告: この引用は必ずしも正確ではありません.