The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement/
In this project, a new generation of lead-free (Sn-Cu-Ni) solder alloy was developed to form a composite solder. Five new lead-free composite solders were successfully synthesized using the powder metallurgy method, which consists of mixing, compaction, and sintering process. This research also assi...
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| Κύριος συγγραφέας: | |
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| Συγγραφή απο Οργανισμό/Αρχή: | |
| Μορφή: | Thesis Βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Perlis, Malaysia
School of Materials Engineering
2016
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