APA (7 ম সংস্করণ) উদ্ধৃতি

Muhammad Nubli Bin Zulkifli. (2008). Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA). Universiti Malaysia Perlis (UniMAP).

শিকাগো স্টাইল (17 তম সংস্করণ) উদ্ধৃতি

Muhammad Nubli Bin Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA). Kangar: Universiti Malaysia Perlis (UniMAP), 2008.

M.L.A (8 ম সংস্করণ) উদ্ধৃতি

Muhammad Nubli Bin Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA). Universiti Malaysia Perlis (UniMAP), 2008.