APA引文

Muhammad Nubli Bin Zulkifli. (2008). Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA). Universiti Malaysia Perlis (UniMAP).

Chicago Style (17th ed.) Citation

Muhammad Nubli Bin Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA). Kangar: Universiti Malaysia Perlis (UniMAP), 2008.

MLA引文

Muhammad Nubli Bin Zulkifli. Temperature Cycling Reliability Test for a Ball Grid Array (BGA) Package Using Finite Element Analysis (FEA). Universiti Malaysia Perlis (UniMAP), 2008.