Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
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| Format: | Thesis Book |
| Language: | English |
| Published: |
Kangar
Universiti Malaysia Perlis (UniMAP)
2008
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| Subjects: | |
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| Item Description: | Tesis 2008 |
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| Physical Description: | xvii, 168 p. ill. 30cm. |