Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

समान संसाधन

• Ball grid array technolog : edited by John H Lau.
  प्रकाशित: (1995)
• Area array packaging handbook : manufacturing and assembly /
  प्रकाशित: (2002)
• Area array packaging materials : adhesive, paste and lead free /
  द्वारा: Gilleo, Ken
  प्रकाशित: (2004)
• Area array packaging materials : adhesives, pastes and lead-free /
  प्रकाशित: (2004)
• Area array packaging handbook manufacturing and assembley
  द्वारा: Gilleo, Ken
  प्रकाशित: (2002)