Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
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| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Kangar
Universiti Malaysia Perlis (UniMAP)
2008
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| 100 | 1 | |a Muhammad Nubli Bin Zulkifli, |e author | |
| 245 | 1 | |a Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA) | |
| 260 | |a Kangar |b Universiti Malaysia Perlis (UniMAP) |c 2008 | ||
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| 541 | |a Gift from Centre for Graduate Studies | ||
| 650 | 0 | |a Ball grid array technology | |
| 650 | 0 | |a Chip scale packaging | |
| 710 | 2 | |a Universiti Malaysia Perlis | |
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