Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Uloženo v:

Podrobná bibliografie
Hlavní autor:	Muhammad Nubli Bin Zulkifli (Autor)
Korporativní autor:	Universiti Malaysia Perlis
Médium:	Diplomová práce Kniha
Jazyk:	English
Vydáno:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Témata:	Ball grid array technology Chip scale packaging
Tagy:	Přidat tag Žádné tagy, Buďte první, kdo otaguje tento záznam!

Podobné jednotky

Ball grid array technolog : edited by John H Lau.
Vydáno: (1995)

Area array packaging handbook : manufacturing and assembly /
Vydáno: (2002)

Area array packaging materials : adhesive, paste and lead free /
Autor: Gilleo, Ken
Vydáno: (2004)

Area array packaging materials : adhesives, pastes and lead-free /
Vydáno: (2004)

Area array packaging handbook manufacturing and assembley
Autor: Gilleo, Ken
Vydáno: (2002)

Area array packaging handbook manufacturing and assembley
Autor: Gilleo, Ken
Vydáno: (2002)

Area array packing handbook : manufacturing and assembly /
Autor: Gilleo, Ken
Vydáno: (2002)

Area array packing handbook : manufacturing and assembly /
Autor: Gilleo, Ken
Vydáno: (2002)

Foldable flex and thinned silicon multichip packaging technology /
Vydáno: (2003)

Advanced flip chip packaging /
Vydáno: (2010)

Advanced flip chip packaging
Vydáno: (2013)

Advanced flip chip packaging
Vydáno: (2013)

Semiconductor packaging : a multidisciplinary approach /
Vydáno: (1994)

Area array package design : techniques in high-density electronics /
Vydáno: (2004)

Area array package design : techniques in high-density electronics /
Vydáno: (2004)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
Autor: Lim, Ming Siong
Vydáno: (2017)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
Autor: Lim, Ming Siong
Vydáno: (2017)

Semiconductor packaging : materials interaction and reliability /
Autor: Chen, Andrea
Vydáno: (2012)

Semiconductor packaging : materials interaction and reliability /
Autor: Chen, Andrea
Vydáno: (2012)

Electronic packaging : design, materials, process, and reliability /
Vydáno: (1998)

Microelectronic packaging /
Vydáno: (2005)

Microelectronic packaging /
Vydáno: (2005)

Semiconductor Packaging (EMT 453/3) /

Packaging, reliability and manufacturing issues associated with electronic and photonic products /
Vydáno: (2001)

Fundamentals of microsystems packaging
Vydáno: (2001)

Fundamentals of microsystems packaging
Vydáno: (2001)

Principles of electronic packaging /
Vydáno: (1989)

Introduction to microsystem packaging technology /
Autor: Jin, Yufeng
Vydáno: (2011)

Electronic packaging : materials and their properties /
Autor: Pecht, Michael G.
Vydáno: (1999)

Packaging of electronic systems : a mechanical engineering approach /
Autor: Dally, James W.
Vydáno: (1990)

Journal of electronic packaging.
Vydáno: (1989)

Principles of electronic packaging /
Vydáno: (1989)

Materials for electronic packaging /
Vydáno: (1995)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
Autor: Jamnia, Ali
Vydáno: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
Autor: Jamnia, Ali
Vydáno: (2009)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
Autor: Jamnia, Ali, 1961-
Vydáno: (2003)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
Autor: Liu, Sheng
Vydáno: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
Autor: Liu, Sheng
Vydáno: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
Autor: Liu, Sheng
Vydáno: (2011)

Bio and nano packaging techniques for electron devices /
Vydáno: (2012)