Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Bibliografiske detaljer
Hovedforfatter:	Muhammad Nubli Bin Zulkifli (Author)
Institution som forfatter:	Universiti Malaysia Perlis
Format:	Thesis Bog
Sprog:	English
Udgivet:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Fag:	Ball grid array technology Chip scale packaging
Tags:	Tilføj Tag Ingen Tags, Vær først til at tagge denne postø!

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