Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Gorde:

Xehetasun bibliografikoak
Egile nagusia:	Muhammad Nubli Bin Zulkifli (Egilea)
Erakunde egilea:	Universiti Malaysia Perlis
Formatua:	Thesis Liburua
Hizkuntza:	English
Argitaratua:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Gaiak:	Ball grid array technology Chip scale packaging
Etiketak:	Etiketa erantsi Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!

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