Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Bibliografski detalji
Glavni autor:	Muhammad Nubli Bin Zulkifli (Autor)
Autor kompanije:	Universiti Malaysia Perlis
Format:	Disertacija Knjiga
Jezik:	English
Izdano:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Teme:	Ball grid array technology Chip scale packaging
Oznake:	Dodaj oznaku Bez oznaka, Budi prvi tko označuje ovaj zapis!

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