Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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書誌詳細
第一著者:	Muhammad Nubli Bin Zulkifli (著者)
団体著者:	Universiti Malaysia Perlis
フォーマット:	学位論文図書
言語:	English
出版事項:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
主題:	Ball grid array technology Chip scale packaging
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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