Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Библиографические подробности
Главный автор:	Muhammad Nubli Bin Zulkifli (Автор)
Соавтор:	Universiti Malaysia Perlis
Формат:	Диссертация ‌
Язык:	English
Опубликовано:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Предметы:	Ball grid array technology Chip scale packaging
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

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