Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Shranjeno v:

Bibliografske podrobnosti
Glavni avtor:	Muhammad Nubli Bin Zulkifli (Author)
Korporativna značnica:	Universiti Malaysia Perlis
Format:	Thesis Knjiga
Jezik:	English
Izdano:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Teme:	Ball grid array technology Chip scale packaging
Oznake:	Označite Brez oznak, prvi označite!

Podobne knjige/članki

Ball grid array technolog : edited by John H Lau.
Izdano: (1995)

Area array packaging handbook : manufacturing and assembly /
Izdano: (2002)

Area array packaging materials : adhesive, paste and lead free /
od: Gilleo, Ken
Izdano: (2004)

Area array packaging materials : adhesives, pastes and lead-free /
Izdano: (2004)

Area array packaging handbook manufacturing and assembley
od: Gilleo, Ken
Izdano: (2002)

Area array packaging handbook manufacturing and assembley
od: Gilleo, Ken
Izdano: (2002)

Area array packing handbook : manufacturing and assembly /
od: Gilleo, Ken
Izdano: (2002)

Area array packing handbook : manufacturing and assembly /
od: Gilleo, Ken
Izdano: (2002)

Foldable flex and thinned silicon multichip packaging technology /
Izdano: (2003)

Advanced flip chip packaging /
Izdano: (2010)

Advanced flip chip packaging
Izdano: (2013)

Advanced flip chip packaging
Izdano: (2013)

Semiconductor packaging : a multidisciplinary approach /
Izdano: (1994)

Area array package design : techniques in high-density electronics /
Izdano: (2004)

Area array package design : techniques in high-density electronics /
Izdano: (2004)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
od: Lim, Ming Siong
Izdano: (2017)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
od: Lim, Ming Siong
Izdano: (2017)

Semiconductor packaging : materials interaction and reliability /
od: Chen, Andrea
Izdano: (2012)

Semiconductor packaging : materials interaction and reliability /
od: Chen, Andrea
Izdano: (2012)

Electronic packaging : design, materials, process, and reliability /
Izdano: (1998)

Microelectronic packaging /
Izdano: (2005)

Microelectronic packaging /
Izdano: (2005)

Semiconductor Packaging (EMT 453/3) /

Packaging, reliability and manufacturing issues associated with electronic and photonic products /
Izdano: (2001)

Fundamentals of microsystems packaging
Izdano: (2001)

Fundamentals of microsystems packaging
Izdano: (2001)

Principles of electronic packaging /
Izdano: (1989)

Introduction to microsystem packaging technology /
od: Jin, Yufeng
Izdano: (2011)

Electronic packaging : materials and their properties /
od: Pecht, Michael G.
Izdano: (1999)

Packaging of electronic systems : a mechanical engineering approach /
od: Dally, James W.
Izdano: (1990)

Journal of electronic packaging.
Izdano: (1989)

Principles of electronic packaging /
Izdano: (1989)

Materials for electronic packaging /
Izdano: (1995)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
od: Jamnia, Ali
Izdano: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
od: Jamnia, Ali
Izdano: (2009)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
od: Jamnia, Ali, 1961-
Izdano: (2003)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
od: Liu, Sheng
Izdano: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
od: Liu, Sheng
Izdano: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
od: Liu, Sheng
Izdano: (2011)

Bio and nano packaging techniques for electron devices /
Izdano: (2012)