Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Detaylı Bibliyografya
Yazar:	Muhammad Nubli Bin Zulkifli (Yazar)
Müşterek Yazar:	Universiti Malaysia Perlis
Materyal Türü:	Tez Kitap
Dil:	English
Baskı/Yayın Bilgisi:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Konular:	Ball grid array technology Chip scale packaging
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!

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