Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Détails bibliographiques
Auteur principal:	Muhammad Nubli Bin Zulkifli (Auteur)
Collectivité auteur:	Universiti Malaysia Perlis
Format:	Thèse Livre
Langue:	English
Publié:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Sujets:	Ball grid array technology Chip scale packaging
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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