Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Αποθηκεύτηκε σε:

Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς:	Brown, William D., 1943-, Ulrich, Richard K. Ph.D
Μορφή:	Βιβλίο
Γλώσσα:	English
Έκδοση:	Hoboken, NJ Wiley-Interscience/IEEE c2006.
Έκδοση:	Second edition.
Θέματα:	Microelectronic packaging.
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!

Παρόμοια τεκμήρια

Advanced electronic packaging /
Έκδοση: (2006)

Advanced electronic packaging
Έκδοση: (2006)

Advanced electronic packaging
Έκδοση: (2006)

Advanced electronic packaging /
Έκδοση: (2006)

Materials for advanced packaging /
Έκδοση: (2009)

Advanced electronic packaging : with emphasis on multichip modules /
Έκδοση: (1999)

Materials for advanced packaging /
Έκδοση: (2009)

Advanced electronic packaging with emphasis on multichip modules
Έκδοση: (1999)

Advanced electronic packaging with emphasis on multichip modules
Έκδοση: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Έκδοση: (1999)

RF and microwave microelectronics packaging
Έκδοση: (2009)

RF and microwave microelectronics packaging
Έκδοση: (2009)

Area array packaging processes : for BGA, flip chip and CSP /
Έκδοση: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Force sensors for microelectronic packaging applications /
ανά: Schwizer, J.
Έκδοση: (2005)

Force sensors for microelectronic packaging applications /
ανά: Schwizer, J.
Έκδοση: (2005)

Bio and nano packaging techniques for electron devices /
Έκδοση: (2012)

Chip scale package (CSP) : design, materials, processes, reliability and application /
ανά: Lau, John H.
Έκδοση: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Έκδοση: (1998)

Microelectronic packaging /
Έκδοση: (2005)

Microelectronic packaging /
Έκδοση: (2005)

MEMS and microsystems : design and manufacture /
ανά: Hsu, Tai-Ran
Έκδοση: (2002)

Mems and microsystems : design, manufacture, and nanoscale engineering
ανά: Hsu, Tai-Ran
Έκδοση: (2008)

MEMS and microsystems : design, manufacture and nanoscale engineering /
ανά: Hsu, Tai-Ran
Έκδοση: (2008)

Semiconductor packaging : materials interaction and reliability /
ανά: Chen, Andrea
Έκδοση: (2012)

Semiconductor packaging : materials interaction and reliability /
ανά: Chen, Andrea
Έκδοση: (2012)

Advanced MEMS packaging /
Έκδοση: (2010)

Advanced MEMS packaging
Έκδοση: (2010)

Advanced MEMS packaging /

Introduction to microsystem packaging technology /
ανά: Jin, Yufeng
Έκδοση: (2011)

RF and microwave microelectronics packaging II
Έκδοση: (2017)

RF and microwave microelectronics packaging II
Έκδοση: (2017)

Plastic encapsulated microelectronics : materials, processes, quality, reliability, and applications /
ανά: Pecht, Michael
Έκδοση: (1995)

Chip scale package (CSP) design, materials, processes, reliability, and applications
ανά: Lau, John H.
Έκδοση: (1999)

Chip scale package (CSP) design, materials, processes, reliability, and applications
ανά: Lau, John H.
Έκδοση: (1999)

Mems packaging /
Έκδοση: (2004)

Semiconductor Packaging (EMT 453/3) /

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
ανά: Siti Amaniah Mohd Chachuli
Έκδοση: (2012)

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
ανά: Siti Amaniah Mohd Chachuli
Έκδοση: (2012)

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
ανά: Lau, John H.
Έκδοση: (2000)