Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Awduron Eraill:	Brown, William D., 1943-, Ulrich, Richard K. Ph.D
Fformat:	Llyfr
Iaith:	English
Cyhoeddwyd:	Hoboken, NJ Wiley-Interscience/IEEE c2006.
Rhifyn:	Second edition.
Pynciau:	Microelectronic packaging.
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Eitemau Tebyg

Advanced electronic packaging /
Cyhoeddwyd: (2006)

Advanced electronic packaging
Cyhoeddwyd: (2006)

Advanced electronic packaging
Cyhoeddwyd: (2006)

Advanced electronic packaging /
Cyhoeddwyd: (2006)

Materials for advanced packaging /
Cyhoeddwyd: (2009)

Advanced electronic packaging : with emphasis on multichip modules /
Cyhoeddwyd: (1999)

Materials for advanced packaging /
Cyhoeddwyd: (2009)

Advanced electronic packaging with emphasis on multichip modules
Cyhoeddwyd: (1999)

Advanced electronic packaging with emphasis on multichip modules
Cyhoeddwyd: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Cyhoeddwyd: (1999)

RF and microwave microelectronics packaging
Cyhoeddwyd: (2009)

RF and microwave microelectronics packaging
Cyhoeddwyd: (2009)

Area array packaging processes : for BGA, flip chip and CSP /
Cyhoeddwyd: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Force sensors for microelectronic packaging applications /
gan: Schwizer, J.
Cyhoeddwyd: (2005)

Force sensors for microelectronic packaging applications /
gan: Schwizer, J.
Cyhoeddwyd: (2005)

Bio and nano packaging techniques for electron devices /
Cyhoeddwyd: (2012)

Chip scale package (CSP) : design, materials, processes, reliability and application /
gan: Lau, John H.
Cyhoeddwyd: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Cyhoeddwyd: (1998)

Microelectronic packaging /
Cyhoeddwyd: (2005)

Microelectronic packaging /
Cyhoeddwyd: (2005)

MEMS and microsystems : design and manufacture /
gan: Hsu, Tai-Ran
Cyhoeddwyd: (2002)

Mems and microsystems : design, manufacture, and nanoscale engineering
gan: Hsu, Tai-Ran
Cyhoeddwyd: (2008)

MEMS and microsystems : design, manufacture and nanoscale engineering /
gan: Hsu, Tai-Ran
Cyhoeddwyd: (2008)

Semiconductor packaging : materials interaction and reliability /
gan: Chen, Andrea
Cyhoeddwyd: (2012)

Semiconductor packaging : materials interaction and reliability /
gan: Chen, Andrea
Cyhoeddwyd: (2012)

Advanced MEMS packaging /
Cyhoeddwyd: (2010)

Advanced MEMS packaging
Cyhoeddwyd: (2010)

Advanced MEMS packaging /

Introduction to microsystem packaging technology /
gan: Jin, Yufeng
Cyhoeddwyd: (2011)

RF and microwave microelectronics packaging II
Cyhoeddwyd: (2017)

RF and microwave microelectronics packaging II
Cyhoeddwyd: (2017)

Plastic encapsulated microelectronics : materials, processes, quality, reliability, and applications /
gan: Pecht, Michael
Cyhoeddwyd: (1995)

Chip scale package (CSP) design, materials, processes, reliability, and applications
gan: Lau, John H.
Cyhoeddwyd: (1999)

Chip scale package (CSP) design, materials, processes, reliability, and applications
gan: Lau, John H.
Cyhoeddwyd: (1999)

Mems packaging /
Cyhoeddwyd: (2004)

Semiconductor Packaging (EMT 453/3) /

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
gan: Siti Amaniah Mohd Chachuli
Cyhoeddwyd: (2012)

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
gan: Siti Amaniah Mohd Chachuli
Cyhoeddwyd: (2012)

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
gan: Lau, John H.
Cyhoeddwyd: (2000)