Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

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Bibliografiske detaljer
Andre forfattere:	Brown, William D., 1943-, Ulrich, Richard K. Ph.D
Format:	Bog
Sprog:	English
Udgivet:	Hoboken, NJ Wiley-Interscience/IEEE c2006.
Udgivelse:	Second edition.
Fag:	Microelectronic packaging.
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Lignende værker

Advanced electronic packaging /
Udgivet: (2006)

Advanced electronic packaging
Udgivet: (2006)

Advanced electronic packaging
Udgivet: (2006)

Advanced electronic packaging /
Udgivet: (2006)

Materials for advanced packaging /
Udgivet: (2009)

Advanced electronic packaging : with emphasis on multichip modules /
Udgivet: (1999)

Materials for advanced packaging /
Udgivet: (2009)

Advanced electronic packaging with emphasis on multichip modules
Udgivet: (1999)

Advanced electronic packaging with emphasis on multichip modules
Udgivet: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Udgivet: (1999)

RF and microwave microelectronics packaging
Udgivet: (2009)

RF and microwave microelectronics packaging
Udgivet: (2009)

Area array packaging processes : for BGA, flip chip and CSP /
Udgivet: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Force sensors for microelectronic packaging applications /
af: Schwizer, J.
Udgivet: (2005)

Force sensors for microelectronic packaging applications /
af: Schwizer, J.
Udgivet: (2005)

Bio and nano packaging techniques for electron devices /
Udgivet: (2012)

Chip scale package (CSP) : design, materials, processes, reliability and application /
af: Lau, John H.
Udgivet: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Udgivet: (1998)

Microelectronic packaging /
Udgivet: (2005)

Microelectronic packaging /
Udgivet: (2005)

MEMS and microsystems : design and manufacture /
af: Hsu, Tai-Ran
Udgivet: (2002)

Mems and microsystems : design, manufacture, and nanoscale engineering
af: Hsu, Tai-Ran
Udgivet: (2008)

MEMS and microsystems : design, manufacture and nanoscale engineering /
af: Hsu, Tai-Ran
Udgivet: (2008)

Semiconductor packaging : materials interaction and reliability /
af: Chen, Andrea
Udgivet: (2012)

Semiconductor packaging : materials interaction and reliability /
af: Chen, Andrea
Udgivet: (2012)

Advanced MEMS packaging /
Udgivet: (2010)

Advanced MEMS packaging
Udgivet: (2010)

Advanced MEMS packaging /

Introduction to microsystem packaging technology /
af: Jin, Yufeng
Udgivet: (2011)

RF and microwave microelectronics packaging II
Udgivet: (2017)

RF and microwave microelectronics packaging II
Udgivet: (2017)

Plastic encapsulated microelectronics : materials, processes, quality, reliability, and applications /
af: Pecht, Michael
Udgivet: (1995)

Chip scale package (CSP) design, materials, processes, reliability, and applications
af: Lau, John H.
Udgivet: (1999)

Chip scale package (CSP) design, materials, processes, reliability, and applications
af: Lau, John H.
Udgivet: (1999)

Mems packaging /
Udgivet: (2004)

Semiconductor Packaging (EMT 453/3) /

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
af: Siti Amaniah Mohd Chachuli
Udgivet: (2012)

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
af: Siti Amaniah Mohd Chachuli
Udgivet: (2012)

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
af: Lau, John H.
Udgivet: (2000)