Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

में बचाया:

ग्रंथसूची विवरण
अन्य लेखक:	Brown, William D., 1943-, Ulrich, Richard K. Ph.D
स्वरूप:	पुस्तक
भाषा:	English
प्रकाशित:	Hoboken, NJ Wiley-Interscience/IEEE c2006.
संस्करण:	Second edition.
विषय:	Microelectronic packaging.
टैग :	टैग जोड़ें कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!

समान संसाधन

Advanced electronic packaging /
प्रकाशित: (2006)

Advanced electronic packaging
प्रकाशित: (2006)

Advanced electronic packaging
प्रकाशित: (2006)

Advanced electronic packaging /
प्रकाशित: (2006)

Materials for advanced packaging /
प्रकाशित: (2009)

Advanced electronic packaging : with emphasis on multichip modules /
प्रकाशित: (1999)

Materials for advanced packaging /
प्रकाशित: (2009)

Advanced electronic packaging with emphasis on multichip modules
प्रकाशित: (1999)

Advanced electronic packaging with emphasis on multichip modules
प्रकाशित: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
प्रकाशित: (1999)

RF and microwave microelectronics packaging
प्रकाशित: (2009)

RF and microwave microelectronics packaging
प्रकाशित: (2009)

Area array packaging processes : for BGA, flip chip and CSP /
प्रकाशित: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Force sensors for microelectronic packaging applications /
द्वारा: Schwizer, J.
प्रकाशित: (2005)

Force sensors for microelectronic packaging applications /
द्वारा: Schwizer, J.
प्रकाशित: (2005)

Bio and nano packaging techniques for electron devices /
प्रकाशित: (2012)

Chip scale package (CSP) : design, materials, processes, reliability and application /
द्वारा: Lau, John H.
प्रकाशित: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
प्रकाशित: (1998)

Microelectronic packaging /
प्रकाशित: (2005)

Microelectronic packaging /
प्रकाशित: (2005)

MEMS and microsystems : design and manufacture /
द्वारा: Hsu, Tai-Ran
प्रकाशित: (2002)

Mems and microsystems : design, manufacture, and nanoscale engineering
द्वारा: Hsu, Tai-Ran
प्रकाशित: (2008)

MEMS and microsystems : design, manufacture and nanoscale engineering /
द्वारा: Hsu, Tai-Ran
प्रकाशित: (2008)

Semiconductor packaging : materials interaction and reliability /
द्वारा: Chen, Andrea
प्रकाशित: (2012)

Semiconductor packaging : materials interaction and reliability /
द्वारा: Chen, Andrea
प्रकाशित: (2012)

Advanced MEMS packaging /
प्रकाशित: (2010)

Advanced MEMS packaging
प्रकाशित: (2010)

Advanced MEMS packaging /

Introduction to microsystem packaging technology /
द्वारा: Jin, Yufeng
प्रकाशित: (2011)

RF and microwave microelectronics packaging II
प्रकाशित: (2017)

RF and microwave microelectronics packaging II
प्रकाशित: (2017)

Plastic encapsulated microelectronics : materials, processes, quality, reliability, and applications /
द्वारा: Pecht, Michael
प्रकाशित: (1995)

Chip scale package (CSP) design, materials, processes, reliability, and applications
द्वारा: Lau, John H.
प्रकाशित: (1999)

Chip scale package (CSP) design, materials, processes, reliability, and applications
द्वारा: Lau, John H.
प्रकाशित: (1999)

Mems packaging /
प्रकाशित: (2004)

Semiconductor Packaging (EMT 453/3) /

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
द्वारा: Siti Amaniah Mohd Chachuli
प्रकाशित: (2012)

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
द्वारा: Siti Amaniah Mohd Chachuli
प्रकाशित: (2012)

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
द्वारा: Lau, John H.
प्रकाशित: (2000)