Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales /

Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales /

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Bibliographic Details
Main Author: Luo, Jianfeng (Author)
Other Authors: Dornfeld, D. A.
Format: Book
Language:English
Published: London Springer c2004.
Subjects:
Integrated circuits > Design and construction.
Integrated circuits > Design and construction > Simulation methods.
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