Cita APA (7th ed.)

Kraus, A. D., Pecht, M., & Hannemann, R. J. (1994). Semiconductor packaging: A multidisciplinary approach. John Wiley & Sons.

Cita Chicago (17th ed.)

Kraus, Allan D., Michael Pecht, i Robert J. Hannemann. Semiconductor Packaging: A Multidisciplinary Approach. New York: John Wiley & Sons, 1994.

Cita MLA (8th ed.)

Kraus, Allan D., et al. Semiconductor Packaging: A Multidisciplinary Approach. John Wiley & Sons, 1994.

Atenció: Aquestes cites poden no estar 100% correctes.