Semiconductor packaging : a multidisciplinary approach /

Semiconductor packaging : a multidisciplinary approach /

Zapisane w:

Opis bibliograficzny
Kolejni autorzy:	Kraus, Allan D., Pecht, Michael, Hannemann, Robert J. 1948-
Format:	Książka
Język:	English
Wydane:	New York John Wiley & Sons 1994
Hasła przedmiotowe:	Electronic packaging. Integrated circuits > Very large scale integration.
Etykiety:	Dodaj etykietę Nie ma etykietki, Dołącz pierwszą etykiete!

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