Hybrid assemblies and multichip modules /
Gorde:
| Egile nagusia: | |
|---|---|
| Formatua: | Liburua |
| Hizkuntza: | English |
| Argitaratua: |
New York
Marcel Dekker
c1993.
|
| Saila: | Manufacturing engineering and materials processing
38 |
| Gaiak: | |
| Etiketak: |
Etiketa erantsi
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
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| 003 | MY-ArUMP | ||
| 005 | 20210731231454.0 | ||
| 008 | 120309s1993 xx 000 0 eng d | ||
| 020 | |a 0824784669 |c RM542.7 | ||
| 035 | |a (OCoLC)ocm26767567 | ||
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| 040 | |a MYPMP |b eng |e rda |c MYPMP | ||
| 090 | 0 | 0 | |a TK7874 |b K24 1993 |
| 100 | 1 | |a Kear, Fred W., |e author | |
| 245 | 1 | 0 | |a Hybrid assemblies and multichip modules / |c by Fred W. Kear |
| 264 | 1 | |a New York |b Marcel Dekker |c c1993. | |
| 264 | 4 | |c ©1993 | |
| 300 | |a x, 278 pages: |b illustrations; |c 23 cm. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a unmediated |b n |2 rdamedia | ||
| 338 | |a volume |b nc |2 rdacarrier | ||
| 440 | |a Manufacturing engineering and materials processing |v 38 | ||
| 504 | |a Includes bibliographical references and index. | ||
| 541 | |a CERDIK |d 16-Aug-03 | ||
| 591 | |a PAMERAN | ||
| 594 | |a 2-Dec-03 | ||
| 650 | 0 | |a Hybrid integrated circuits |x Design and construction. | |
| 650 | 0 | |a Multichip modules (Microelectronics) |x Design and construction. | |
| 942 | |2 lcc |c BK-OS | ||
| 949 | |a VIRTUAITEM |d 10000 |f 1 |x 1 |6 010106 |9 1 | ||
| 999 | |c 83515 |d 83515 | ||
| 952 | |0 0 |1 0 |2 lcc |4 0 |6 TK7874 K24 01993 |7 0 |9 73721 |a PTSFP |b PTSFP |c 1 |d 2021-07-31 |o TK7874 K24 1993 |p 010106 |r 2021-07-31 |t 1 |w 2021-07-31 |y BK-OS | ||