Hybrid assemblies and multichip modules /

Hybrid assemblies and multichip modules /

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Bibliographic Details
Main Author: Kear, Fred W. (Author)
Format: Book
Language:English
Published: New York Marcel Dekker c1993.
Series:Manufacturing engineering and materials processing 38
Subjects:
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.
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