APA (7th ed.) Citation

Alexe, M., & Gosele, U. (2004). Wafer bonding: Applications and technology. Springer.

Chicago Style (17th ed.) Citation

Alexe, M., and U. Gosele. Wafer Bonding: Applications and Technology. Berlin: Springer, 2004.

MLA (8th ed.) Citation

Alexe, M., and U. Gosele. Wafer Bonding: Applications and Technology. Springer, 2004.

Warning: These citations may not always be 100% accurate.