Wafer bonding : applications and technology /

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Bibliographic Details
Other Authors: Alexe, M. (Marin), Gosele, U.
Format: Book
Language:English
Published: Berlin Springer c2004.
Series:Springer series in materials science,
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Description
Physical Description:xv, 499 pages: illustrations; 24 cm.
Bibliography:Includes bibliographical references.
ISBN:3540210490
ISSN:0933-033X