APA (7th ed.) Citation

Li, E. (2012). Electrical modeling and design for 3D integration: 3D integrated circuits and packaging, signal integrity, power integrity and EMC. Wiley-IEEE Press.

Chicago Style (17th ed.) Citation

Li, Er-Ping. Electrical Modeling and Design for 3D Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Hoboken, N.J: Wiley-IEEE Press, 2012.

MLA (8th ed.) Citation

Li, Er-Ping. Electrical Modeling and Design for 3D Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley-IEEE Press, 2012.