Multichip module technology handbook /

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Bibliographic Details
Main Author:	Garrou, Philip E. (Author)
Other Authors:	Turlik, Iwona
Format:	Book
Language:	English
Series:	Electronic packaging and interconnection series
Subjects:	Multichip modules (Microelectronics) Microelectronics packing Integrated circuits > Very large scale integration > Design and construction.
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