Simulation on parameter and characteristics extraction between two simulation packages (synopsys and pspice)

Simulation on parameter and characteristics extraction between two simulation packages (synopsys and pspice)

The objective is of this project is to match these two program packages in the area of parameter and characteristics extraction. First, an initial device of NMOS of gate length of 1.5¡Łm with different values of substrate concentration and gate oxide thickness is created by using TSUPREM-4 from Syno...

Πλήρης περιγραφή

Αποθηκεύτηκε σε:

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Nor Aznin Sakrani (Συγγραφέας)
Μορφή:	Ηλεκτρονική πηγή Λογισμικό Βάση Δεδομένων
Γλώσσα:	English
Θέματα:	Microelectronics
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!

Παρόμοια τεκμήρια

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Improvement of SiGe HBT design and technology performance using device simulation
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Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.
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Έκδοση: (2009)

RF and microwave microelectronics packaging
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Materials for advanced packaging /
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Advanced electronic packaging with emphasis on multichip modules
Έκδοση: (1999)

Advanced electronic packaging with emphasis on multichip modules
Έκδοση: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
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