APA (7e ed.) Bronvermelding

Norahmad Barzrul Basaruddin. Characterization of electroless under bump metallury for AlSi bond pad composition.

Chicago (17e ed.) Bronvermelding

Norahmad Barzrul Basaruddin. Characterization of Electroless Under Bump Metallury for AlSi Bond Pad Composition.

MLA (8e ed.) Bronvermelding

Norahmad Barzrul Basaruddin. Characterization of Electroless Under Bump Metallury for AlSi Bond Pad Composition.

Let op: Deze citaties zijn niet altijd 100% accuraat.