Characterization of electroless under bump metallury for AlSi bond pad composition

Characterization of electroless under bump metallury for AlSi bond pad composition

The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up proc...

Disgrifiad llawn

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Prif Awdur:	Norahmad Barzrul Basaruddin (Awdur)
Fformat:	Electronig Meddalwedd Cronfa ddata
Iaith:	English
Pynciau:	Microelectronics.
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

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