Characterization of electroless under bump metallury for AlSi bond pad composition

Characterization of electroless under bump metallury for AlSi bond pad composition

The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up proc...

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Bibliografiske detaljer
Hovedforfatter:	Norahmad Barzrul Basaruddin (Author)
Format:	Electronisk Software Database
Sprog:	English
Fag:	Microelectronics.
Tags:	Tilføj Tag Ingen Tags, Vær først til at tagge denne postø!

Lignende værker

MIMOS Berhad Technology Park
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Udgivet: (2006)

Simulation, fabrication and electrical characterization of p-Si capacitor design structure
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Single cyrstal SiC capacitive pressure sensor
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Microfluidic poly-si electrodes capacitor (fabricate & testing)
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Study the effect of bird's beak on fully recessed locos and poly buffered locos using 2 different pad oxide
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Design, fabricating and characterizing a microfluidic capacitor
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CMOS Inverter-Circuit Characterization and Performance Estimation/
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Study of the temperature effect on thickness and surface roughness of Si02
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Design, Simulation and Characterization of Moly Permalloy based Electromagnetic sensor/
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Udgivet: (2011)

Improvement of SiGe HBT design and technology performance using device simulation
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Characterization of intermetallic growth in gold ballbonds on aluminum metallization [electronic resource] /
af: Lim, Moy Fung

Gate oxide interrity (GOI) characterization for deep submicron CMOS device
af: Norain Bt Mohd Saad

Electrical characterization of 0.13℗æm CMOS transistor using TSUPREM-4 and MEDICI
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Electrical characterization of 0.15um CMOS transistor using tsuprem-4 and medici
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Theoretical study, simulation & fabrication on dry oxidation in terms of Si02 layer thinckness, resistivity & surface roughness
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Electrical characterization of 0.13℗æm NMOS transistor with retrograde well and halo implant structure respectively
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Fabrication and characterization of barium strontium titanate (BA1-XSRXTI03BST) for heat sensor application
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Structural & electrical characterization of Ba(0.5)S(0.5)Tio3 thin films in effect annealing temperature
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Designing and characterizing a low-power low-voltage CMOS operational transconductance amplifier (OTA) using mentor graphics
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Future trends in microelectronics : frontiers and innovations /
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Microelectronics /
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Understanding microelectronics : a top-down approach /
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Udgivet: (2012)

Development of automated food cooking system /
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Udgivet: (2013)

Microelectronics /
Udgivet: (1999)

Microelectronic systems for technicians /
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Udgivet: (1984)

Microelectronic systems : Level 3 /
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Udgivet: (1983)

Microelectronic systems level II /
Udgivet: (1982)

Microsystem engineering of lab-on-a-chip devices /
Udgivet: (2008)

Electronic devices & circuits - II /
af: Godse, Atul P.
Udgivet: (2008)

Vertical electrostatic comb-drive actuator for MEMs design /
af: Wan Mokhdzani Wan Nor Haimi
Udgivet: (2008)

Power microelectronics : device and process technologies /
af: Liang, Yung C.
Udgivet: (2008)

Introduction to microelectronics technology (DES 4012) /
af: Muhammad Suhaimi Sulong
Udgivet: (2008)

Microsystem engineering of lab-on-a-chip devices /
Udgivet: (2004)

Microelectronics /
af: Whitaker, Jerry C.
Udgivet: (2006)

Microcomputer engineering /
af: Miller, Gene H.
Udgivet: (2004)

Microelectronic cicruits and devices /
af: Horenstein, Mark N.
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Microsystem technology /
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Udgivet: (2001)

Greenhouse monitoring
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Udgivet: (2015)

High speed 8-Bits X 8-Bits wallace tree multiplier
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Low cost radio controlled (RC) car with speed controller
af: Wan Adzli Wan Ahmad