Characterization of electroless under bump metallury for AlSi bond pad composition
The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up proc...
Na minha lista:
| Autor principal: | |
|---|---|
| Formato: | Recurso Eletrônico Software Base de Dados |
| Idioma: | English |
| Assuntos: | |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|
Seja o primeiro a deixar um comentário!