Characterization of electroless under bump metallury for AlSi bond pad composition
The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up proc...
Sábháilte in:
| Príomhchruthaitheoir: | |
|---|---|
| Formáid: | Leictreonach Bogearraí Bunachar sonraí |
| Teanga: | English |
| Ábhair: | |
| Clibeanna: |
Cuir clib leis
Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!
|
Cothabháil á déanamh ar an gcóras
Níl fáil ar ár mbunachar sonraí beo faoi láthair.
Labhair le ball foirne sula gcuirfidh tú iarratas isteach toisc go bhféadfadh sé nach bhfuil an fhaisnéis atá á taispeáint anseo cothrom le dáta.