The effect of process parameters on metal step coverage for aluminum (AI) by evaporation technique
The degree to which deposited metals cover steps over topography is important to the yield and reliability of devices in very large scale integrations (VLSI). In evaporated and sputtered thin films, the most difficult steps to cover are those with straight walls. This is especially true with alum...
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic Software Database |
| Language: | English |
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance: