The effect of process parameters on metal step coverage for aluminum (AI) by evaporation technique
The degree to which deposited metals cover steps over topography is important to the yield and reliability of devices in very large scale integrations (VLSI). In evaporated and sputtered thin films, the most difficult steps to cover are those with straight walls. This is especially true with alum...
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| Format: | Electronic Software Database |
| Language: | English |
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