Chuah, R. Y. Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application.
Chicago Style (17th ed.) CitationChuah, Run Yi. Effect of Particle Size and Milling Process on the Microstructure and Thermal Properties of Copper Silicon Carbide (CuSiC) Composites for Electronic Packing Application.
MLA (8th ed.) CitationChuah, Run Yi. Effect of Particle Size and Milling Process on the Microstructure and Thermal Properties of Copper Silicon Carbide (CuSiC) Composites for Electronic Packing Application.
Warning: These citations may not always be 100% accurate.