Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application
The objective of this final year project is to study the effect of particle size and milling process on the microstructure and thermal properties of the CuSiC composite. By varying the parameter of milling process such as milling time and speed, the microstructure, followed by the density and therma...
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| Formato: | Recurso Eletrônico Software Base de Dados |
| Idioma: | English |
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| Resumo: | The objective of this final year project is to study the effect of particle size and milling process on the microstructure and thermal properties of the CuSiC composite. By varying the parameter of milling process such as milling time and speed, the microstructure, followed by the density and thermal properties, will be different. This differences is evaluated by examining the microstructure and carry out characteristic testing on the density and thermal conductivity properties of the finished CuSiC. |
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| Descrição do item: | Final Year Project |
| Descrição Física: | 1 CD-ROM 4 3/4 in. |