Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application
The objective of this final year project is to study the effect of particle size and milling process on the microstructure and thermal properties of the CuSiC composite. By varying the parameter of milling process such as milling time and speed, the microstructure, followed by the density and therma...
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| LEADER | 01590nmi a2200241 a 4500 | ||
|---|---|---|---|
| 001 | vtls000051450 | ||
| 003 | MY-KaKUK | ||
| 005 | 20210816100211.0 | ||
| 007 | co bg llla a | ||
| 008 | 111129s2008 my f d 000 0 eng d | ||
| 039 | 9 | |a 201111291647 |b VLOAD |c 201007301126 |d AYAR |c 200909081153 |d RAR |y 200904211246 |z SNSA | |
| 090 | 0 | 0 | |a TN665 |b B2C559 2008 |
| 100 | 1 | |a Chuah, Run Yi. |e author | |
| 245 | 1 | 0 | |a Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application |h [electronic resource] / |c Chuah Run Yi. |
| 264 | 0 | |a Perlis, Malaysia |b School of Materials Engineering, Universiti Malaysia Perlis |c 2008. | |
| 300 | |a 1 CD-ROM |c 4 3/4 in. | ||
| 500 | |a Final Year Project | ||
| 520 | |a The objective of this final year project is to study the effect of particle size and milling process on the microstructure and thermal properties of the CuSiC composite. By varying the parameter of milling process such as milling time and speed, the microstructure, followed by the density and thermal properties, will be different. This differences is evaluated by examining the microstructure and carry out characteristic testing on the density and thermal conductivity properties of the finished CuSiC. | ||
| 650 | 0 | |a Metallurgy. | |
| 949 | |a VIRTUAITEM |d 30000 |f 1 |x 701 |6 902000269 |a TN665 B2C559 2008 | ||
| 942 | |2 lcc |c COMPFILE | ||
| 999 | |c 92194 |d 92194 | ||
| 952 | |0 0 |1 0 |2 lcc |4 0 |6 TN0665 B2 C559 02008 |7 0 |9 89718 |a PTSFP |b PTSFP |c 8 |d 2021-08-16 |l 0 |o TN665 B2C559 2008 |p 902000269 |r 2021-08-16 |t 1 |w 2021-08-16 |y COMPFILE | ||