Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application
The objective of this final year project is to study the effect of particle size and milling process on the microstructure and thermal properties of the CuSiC composite. By varying the parameter of milling process such as milling time and speed, the microstructure, followed by the density and therma...
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| Format: | Electronic Software Database |
| Language: | English |
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