Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application

Effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (CuSiC) composites for electronic packing application

The objective of this final year project is to study the effect of particle size and milling process on the microstructure and thermal properties of the CuSiC composite. By varying the parameter of milling process such as milling time and speed, the microstructure, followed by the density and therma...

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書誌詳細
第一著者:	Chuah, Run Yi (著者)
フォーマット:	電子媒体ソフトウェアデータベース
言語:	English
主題:	Metallurgy.
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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