Tan, H. K. Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP.
Chicago-Zitierstil (17. Ausg.)Tan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.
MLA-Zitierstil (8. Ausg.)Tan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.