Tan, H. K. Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP.
Citação norma ChicagoTan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.
Citação norma MLATan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.