Tan, H. K. Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP.
Chicago Style (17th ed.) CitationTan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.
MLA引文Tan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.
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