APA (7e ed.) Bronvermelding

Tan, H. K. Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP.

Chicago (17e ed.) Bronvermelding

Tan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.

MLA (8e ed.) Bronvermelding

Tan, Hui Khin. Developing a Mold Technology Module for Freescale - Study on Effects of Materials (compound Properties) and Molding Process Parameters on Package Moldability for QFP.