Leong, H. S. Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package.
Cita Chicago (17th ed.)Leong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.
Cita MLA (8th ed.)Leong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.
Atenció: Aquestes cites poden no estar 100% correctes.