Leong, H. S. Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package.
Chicago Style (17th ed.) CitationLeong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.
MLA (8th ed.) CitationLeong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.
Warning: These citations may not always be 100% accurate.