Leong, H. S. Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package.
芝加哥风格引文Leong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.
MLA引文Leong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.
警告：这些引文格式不一定是100％准确.